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749.00 ₪
Antenna-in-Package Technology and Applications
749.00 ₪
ISBN13
9781119556633
יצא לאור ב
Hoboken
זמן אספקה
21 ימי עסקים
עמודים
400
פורמט
Hardback
תאריך יציאה לאור
3 ביולי 2020
שם סדרה
Wiley - IEEE
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging
Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP.
The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:
- Includes a brief history of antenna-in-package technology
- Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)
- Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance
Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
עמודים | 400 |
---|---|
פורמט | Hardback |
ISBN10 | 1119556635 |
יצא לאור ב | Hoboken |
תאריך יציאה לאור | 3 ביולי 2020 |
תוכן עניינים | Chapter 1: Introduction Yueping Zhang Chapter 2: Antennas for AiP Technology Yueping Zhang Chapter 3: Package Technologies Dr Ning Ye Chapter 4: Electrical, Mechanical, and Thermal Co-Design Xiaoxiong Gu and Pritish R Parida Chapter 5: Antenna-in-Package Measurements A.C.F. Reniers, U. Johannsen and A.B. Smolders Chapter 6: Antenna-in-Package Designs in Multilayered Low Temperature Co-fired Ceramic (LTCC) Platforms Atif Shamim, Haoran Zhang Chapter 7: Antenna Integration in Packaging Technology from 60 GHz up to 300 GHz (HDI-Based AiP) Dr. Frederic Gianesello, Dr. Diane Titz, and Prof. Cyril Luxey Chapter 8: Antenna-in-Package Integration for Fan-Out WLP (FOWLP) Maciej Wojnowski, Klaus Pressel Chapter 9: 3D-Printing-Based AiP Tong-Hong Lin, Ryan A. Bahr, Manos M. Tentzeris Chapter 10: SLC-based AiP for Phased Array Applications Dr. Duixian Liu, Xiaoxiong Gu Chapter 11: 3D AiP for Power Transfer, Sensor Nodes, and IoT Applications Dr. Amin Enayati*, Karin Mohammadpour?Aghdam, Farbod Molaei?Ghale |
זמן אספקה | 21 ימי עסקים |
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